800 MHz Memory ICs

Types of Memory ICs

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Results: 233
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Organisation Interface Type Minimum Operating Temperature Maximum Operating Temperature Packaging
GSI Technology SRAM 1.2/1.25V 8M x 18 144M Non-Stocked
Min.: 10
Mult.: 10

SRAM SMD/SMT BGA-260 144 Mbit 8 M x 18 Parallel 0 C + 85 C Tray
GSI Technology SRAM 1.2/1.25V 4M x 36 144M Non-Stocked
Min.: 10
Mult.: 10

SRAM SMD/SMT BGA-260 144 Mbit 4 M x 36 Parallel 0 C + 85 C Tray
GSI Technology SRAM SigmaDDR-IVe, 144Mb, x18, 800MHz, Commercial Temp Non-Stocked
Min.: 10
Mult.: 10

SRAM SMD/SMT BGA-260 144 Mbit 8 M x 18 Serial 0 C + 85 C
GSI Technology SRAM SigmaDDR-IVe, 144Mb, x36, 800MHz, Commercial Temp Non-Stocked
Min.: 10
Mult.: 10

SRAM SMD/SMT BGA-260 144 Mbit 4 M x 36 Parallel 0 C + 85 C
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 A-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 - 40 C + 105 C Reel
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 E-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 0 C + 95 C Reel
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 I-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 - 40 C + 95 C Reel
Alliance Memory DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), INDUSTRIAL TEMP - Tray Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78 Non-Stocked Lead-Time 16 Weeks
Min.: 2.200
Mult.: 2.200

DRAM SMD/SMT FPGA-78 1 Gbit 128 M x 8 0 C + 95 C Tray
Zentel Japan DRAM DDR3 1Gb, 128Mx8, 1600 at CL11, 1.5V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 2.200
Mult.: 2.200

DRAM SMD/SMT FPGA-78 1 Gbit 128 M x 8 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78 Non-Stocked Lead-Time 16 Weeks
Min.: 2.200
Mult.: 2.200

DRAM SMD/SMT FPGA-78 1 Gbit 128 M x 8 0 C + 95 C Tray
Zentel Japan DRAM DDR3L 1Gb, 128Mx8, 1600 at CL11, 1.35V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 2.200
Mult.: 2.200

DRAM SMD/SMT FPGA-78 1 Gbit 128 M x 8 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3 1Gb, 64Mx16, 1600 at CL11, 1.5V, FBGA-96 Non-Stocked Lead-Time 16 Weeks
Min.: 1.900
Mult.: 1.900

DRAM SMD/SMT FPGA-96 1 Gbit 64 M x 16 0 C + 95 C Tray
Zentel Japan DRAM DDR3 1Gb, 64Mx16, 1600 at CL11, 1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 1.900
Mult.: 1.900

DRAM SMD/SMT FPGA-96 1 Gbit 64 M x 16 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3L 1Gb, 64Mx16, 1600 at CL11, 1.35V, FBGA-96 Non-Stocked Lead-Time 16 Weeks
Min.: 1.900
Mult.: 1.900

DRAM SMD/SMT FPGA-96 1 Gbit 64 M x 16 0 C + 95 C Tray
Zentel Japan DRAM DDR3L 1Gb, 64Mx16, 1600 at CL11, 1.35V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 1.900
Mult.: 1.900

DRAM SMD/SMT FPGA-96 1 Gbit 64 M x 16 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3L 8Gb, 512Mx16 (1CS, 1ZQ), 1600 at CL11, 1.35V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 1.900
Mult.: 1.900

DRAM SMD/SMT FPGA-96 8 Gbit 512 M x 16 0 C + 95 C Tray
ISSI DRAM 8G, 1.35V, DDR3L, 512Mx16, 1600MT/s at 11-11-11, 96 ball BGA (9mm x 13mm) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1
DRAM SMD/SMT BGA-96 8 Gbit 512 M x 16 0 C + 95 C
ISSI DRAM 1G, 1.5V, DDR3, 64Mx16, 1600MT/s at 10-10-10, 96 ball BGA (9mm x13mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

DRAM SMD/SMT BGA-96 1 Gbit 64 M x 16 0 C + 95 C Reel
ISSI DRAM 1G, 1.5V, DDR3, 64Mx16, 1600MT/s at 10-10-10, 96 ball BGA (9mm x13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1
: 1.500
DRAM SMD/SMT BGA-96 1 Gbit 64 M x 16 - 40 C + 95 C Reel, Cut Tape
ISSI DRAM 1G, 1.35V, DDR3, 64Mx16, 1600MT/s at 10-10-10, 96 ball BGA (9mm x13mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500
DRAM SMD/SMT BGA-96 1 Gbit 64 M x 16 0 C + 95 C Reel
ISSI DRAM 1333MT/s 64MX16 DDR3 SDRAM with ECC Non-Stocked Lead-Time 52 Weeks
Min.: 190
Mult.: 190

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 - 40 C + 95 C
ISSI DRAM 1333MT/s 64MX16 DDR3 SDRAM with ECC Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 - 40 C + 105 C
ISSI DRAM Automotive (Tc: -40 to +125C), 1G, 1.5V, DDR3 w/ ECC, 64Mx16, 1333MT/s at 9-9-9, 96 ball BGA (9mm x13mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

DRAM SMD/SMT FBGA-96 1 Gbit 64 M x 16 - 40 C + 125 C Reel
ISSI DRAM 4G, 1.5V, DDR3, 256Mx16, 1600MT/s at 11-11-11, 96 ball BGA (9mm x13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

DRAM SMD/SMT BGA-96 4 Gbit 256 M x 16 - 40 C + 95 C Reel