53254 Series Headers & Wire Housings

Results: 14
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Number of Positions
Pitch
Number of Rows
Mounting Style
Termination Style
Mounting Angle
Contact Gender
Contact Plating
Mating Post Length
Termination Post Length
Series
Tradename
Application
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 11Ckt
Datasheet
14.950In Stock
Min.: 1
Mult.: 1

Headers Shrouded 11 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 12Ckt
Datasheet
6.214In Stock
Min.: 1
Mult.: 1

Headers Shrouded 12 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 15Ckt
Datasheet
2.374In Stock
Min.: 1
Mult.: 1

Headers Shrouded 15 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2mm MicroLatch RA HDR 5CKT Square Pin
Datasheet
6.997In Stock
16.000Expected 9/4/2026
Min.: 1
Mult.: 1

Headers Shrouded 5 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2.0 WtB Wafer Assy RA 2Ckt
Datasheet
13.601In Stock
32.000Expected 11/27/2026
Min.: 1
Mult.: 1

Headers Shrouded 2 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 4CKT WTB R/A
Datasheet
22.699In Stock
Min.: 1
Mult.: 1

Headers Shrouded 4 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 6CKT WTB RA 3 SIDED SHROUD
Datasheet
13.136In Stock
Min.: 1
Mult.: 1

Headers Shrouded 6 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 3CKT WTB R/A
Datasheet
2.642In Stock
20.010Expected 12/14/2026
Min.: 1
Mult.: 1

Headers Shrouded 3 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 8CKT WTB R/A
Datasheet
2.999In Stock
8.000Expected 1/8/2027
Min.: 1
Mult.: 1

Headers Shrouded 8 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings W-T-B HDR R/A 9P
Datasheet
787In Stock
Min.: 1
Mult.: 1

Headers Shrouded 9 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 10Ckt
Datasheet
6.063In Stock
6.400Expected 11/19/2026
Min.: 1
Mult.: 1

Headers Shrouded 10 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings 2MM MICROLTCH HDR RA 13CKT SQ PIN
Datasheet
1.175In Stock
Min.: 1
Mult.: 1

Headers Shrouded 13 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 14Ckt
Datasheet
1.608In Stock
Min.: 1
Mult.: 1

Headers Shrouded 14 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.3 mm (0.13 in) 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray
Molex Headers & Wire Housings New 2.0 WtB Wafer As B Wafer Assy RA 7Ck
Datasheet
6In Stock
12.000Expected 11/16/2026
Min.: 1
Mult.: 1

Headers Shrouded 7 Position 2 mm (0.079 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 3.5 mm (0.138 in) 53254 Micro-Latch Wire-to-Board, Signal - 40 C + 105 C Tray