eMMC

Results: 598
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Package/Case
Memory Size
Configuration
Sequential Read
Sequential Write
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
SMART Modular Technologies eMMC 8GB eMMC 153-ball I-temp N/A
Min.: 1
Mult.: 1

BGA-153 8 GB MLC - 40 C + 85 C
SMART Modular Technologies eMMC 16GB eMMC 153-ball I-temp
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

BGA-153 16 GB MLC 270 MB/s 95 MB/s eMMC 5.0 2.7 V 3.6 V - 40 C + 85 C
SMART Modular Technologies eMMC 32GB eMMC 153-ball I-temp
Datasheet
Non-Stocked
Min.: 50
Mult.: 1

BGA-153 32 GB MLC 270 MB/s 95 MB/s eMMC 5.0 2.7 V 3.6 V - 40 C + 85 C
SMART Modular Technologies eMMC 64GB eMMC 153-ball I-temp
Datasheet
Non-Stocked
Min.: 50
Mult.: 1

BGA-153 64 GB MLC 270 MB/s 95 MB/s eMMC 5.0 2.7 V 3.6 V - 40 C + 85 C

Kingston eMMC eMCP 32GB eMMC + 16Gb LPDDR4X x32 IO 254b
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

eMMC FBGA-254 16 GB TLC 300 MB/s 200 MB/s eMMC 5.1 2.7 V 3.6 V - 25 C + 85 C Tray

Kingston eMMC eMCP 32GB eMMC +32Gb LPDDR4X 254b dynamic SLC ON
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

eMMC FBGA-254 32 GB TLC 300 MB/s 200 MB/s eMMC 5.1 2.7 V 3.6 V - 25 C + 85 C Tray

Kingston eMMC I-temp eMMC 5.1 (HS400) 153B 128GB (Sustained Performance)
Datasheet
Lead-Time 16 Weeks
Min.: 1
Mult.: 1

FBGA-153 128 GB TLC 310 MB/s 120 MB/s eMMC 5.1 HS400 1.8 V 3.3 V - 40 C + 85 C Tray

Kingston eMMC I-temp eMMC 5.1 (HS400) 153B 256GB (Sustained Performance)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 152
Mult.: 152

FBGA-153 256 GB TLC 310 MB/s 170 MB/s eMMC 5.1 HS400 1.8 V 3.3 V - 40 C + 85 C Tray

Kingston eMMC eMMC 5.1 (HS400) 153B 256GB (Sustained Performance)
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 152
Mult.: 152

FBGA-153 256 GB TLC 310 MB/s 170 MB/s eMMC 5.1 HS400 1.8 V 3.3 V - 25 C + 85 C Tray

Kingston eMMC I-temp eMMC 5.1 (HS400) 153B 64GB (Sustained Performance)
Datasheet
Lead-Time 16 Weeks
Min.: 1
Mult.: 1

FBGA-153 64 GB TLC 310 MB/s 85 MB/s eMMC 5.1 HS400 1.8 V 3.3 V - 40 C + 85 C Tray

Kingston eMMC eMMC 5.1 (HS400) 153B 64GB (Sustained Performance)
Datasheet
Lead-Time 16 Weeks
Min.: 1
Mult.: 1

FBGA-153 64 GB TLC 310 MB/s 85 MB/s eMMC 5.1 HS400 1.8 V 3.3 V - 25 C + 85 C Tray
SkyHigh Memory eMMC 2GB e.MMC5.1 BGA 11.5 x 13 x 0.8 mm with Reel Packing: 4MB boot code FW
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
Reel: 2.000
FBGA-153 2 GB SLC 186 MB/s 27 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 85 C Reel
SkyHigh Memory eMMC e.MMC5.1 BGA 13 x 11.5 x 0.8 mm Dyn F/W with tray packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Tray
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 11.5 x 13 x 0.8 mm with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
Reel: 2.000
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Reel
SkyHigh Memory eMMC e.MMC5.1 BGA 13 x 11.5 x 0.8 mm Dyn F/W with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.300
Mult.: 2.300
Reel: 2.300
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Reel
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm low power F/W with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
Reel: 2.000
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Reel
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm customized F/W for SONY with tray packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 171
Mult.: 171
VFBGA-153 MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 13 x 11.5 x 0.8mm, 55'C- CISCO
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 1
Mult.: 1
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Tray
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm customized F/W for SONY with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
VFBGA-153 MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 11.5 x 13 x 0.8 mm with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
Reel: 2.000
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Reel
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 13 x 11.5 x 0.8mm, 55'C- CISCO
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
Reel: 2.000
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Reel
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 13 x 11.5 x 0.8 mm low power F/W with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
Reel: 2.000
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 40 C + 105 C Reel
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 9.0 x 7.5 x 0.8 mm low power F/W with reel packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 2.000
Mult.: 2.000
FBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 25 C + 85 C
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 9.0 x 7.5 x 0.8 mm Customized F/W for Huawei with tray packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 225
Mult.: 225
FBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 25 C + 85 C
SkyHigh Memory eMMC 4GB e.MMC5.1 BGA 9.0 x 7.5 x 0.8 mm LPF/W with tray packing
Datasheet
Non-Stocked Lead-Time 22 Weeks
Min.: 225
Mult.: 225
VFBGA-153 4 GB MLC 200 MB/s 10 MB/s eMMC 5.1 2.7 V 3.6 V - 25 C + 85 C Tray