Multiprotocol Modules

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Qualification
Packaging
Quectel Multiprotocol Modules Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
Datasheet
97Expected 8/6/2026
Min.: 1
Mult.: 1

Tray
Quectel Multiprotocol Modules Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, Japan only, mPCIe form factor
Datasheet
200On Order
Min.: 1
Mult.: 1
: 100

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C Patch 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
Datasheet
249On Order
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6E, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5/ 6 GHz triple-band, Bluetooth 5.2, DBS
Datasheet
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 500

2.4 GHz, 5 GHz, 6 GHz PCIe, PCM, UART 1 V 1 V - 30 C + 75 C 19.9 mm x 18 mm x 2.1 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel, Cut Tape
SparkFun Multiprotocol Modules The ESP32-WROOM-32E is a powerful generic Wi-Fi+BT+BLE MCU module that targets a wide variety of applications ranging from low-power sensor networks to the most demanding tasks such as voice encoding music streaming and MP3 decoding. At the core
Datasheet
10On Order
Min.: 1
Mult.: 1
2.4 GHz 20 dBm I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 18 mm x 25.5 mm x 3.1 mm BLE, Bluetooth 4.2 802.11 b/g/n
Murata Electronics Multiprotocol Modules Type 1SJ Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 6.2
Datasheet
210Factory Stock Available
More Info Available
Min.: 1
Mult.: 1
: 1.000

1SJ 868 MHz, 915 MHz 21.5 dBm UART - 40 C + 85 C 10 mm x 8 mm x 1.6 mm LoRa/LoRaWAN Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: LCC(ANT_WIFI/BT), 2MB flash
Datasheet
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 500

Reel, Cut Tape
Quectel Multiprotocol Modules cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
110On Order
Min.: 1
Mult.: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
Datasheet
100Expected 12/4/2026
Min.: 1
Mult.: 1
: 1.000
Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
Datasheet
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 1.000
Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, antenna pin interface
Datasheet
100Expected 9/11/2026
Min.: 1
Mult.: 1
: 1.000

Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, compact LCC package, USB 2.0 interface only, antenna pin interface
Datasheet
100Expected 9/11/2026
Min.: 1
Mult.: 1
: 1.000
Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 2MB flash
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 250
2.4 GHz - 40 C + 105 C Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
Datasheet
100Expected 9/11/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules NXP platform, SDIO Interface
Datasheet
100Expected 12/4/2026
Min.: 1
Mult.: 1
: 1.000
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datasheet
100Expected 8/28/2026
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Murata Electronics Multiprotocol Modules Type 2BZ Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO Bluetooth 5.2 Mod
Datasheet
154Factory Stock Available
More Info Available
MouseReel Available
Min.: 1
Mult.: 1
: 1.000

2BZ 2.4 GHz, 5 GHz SDIO Interface, HCI 3 V 4.8 V - 40 C + 85 C u.FL 11.4 mm x 8.9 mm x 1.4 mm Bluetooth 5.2 Reel, Cut Tape, MouseReel
Murata Electronics Multiprotocol Modules Type 1YM Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.1
Datasheet
406Factory Stock Available
More Info Available
Min.: 1
Mult.: 1
: 1.000

1YM 2.4 GHz, 5 GHz 17 dBm PCIe, SDIO, UART, USB 1.62 V 3.63 V - 30 C + 85 C u.FL 11.8 mm x 8.4 mm x 1.3 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Telink Multiprotocol Modules Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Telink Multiprotocol Modules The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee
Fanstel Multiprotocol Modules Low cost nRF52833 BLE 5.4 module, 512KB flash,128KB RAM, u.FL
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
: 1.000

Reel, Cut Tape
Fanstel Multiprotocol Modules Opensource BT40F BLE 5.4 to nRF9160 LTE gateway.
Non-Stocked Lead-Time 12 Weeks
Min.: 25
Mult.: 25
: 25

Reel
Fanstel Multiprotocol Modules BT840E BLE 5.4 and nRF9160 module for M.2 connector, B key, two u.FL for LTE and GPS antennas.
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
: 15

PCB, u.FL Reel, Cut Tape
Fanstel Multiprotocol Modules BT840F BLE 5.4 and LR62E LoRa combo module for M.2 connector, B Key.
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
: 15

Reel, Cut Tape
Fanstel Multiprotocol Modules Opensource USB dongle with BT840X.
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 50
Mult.: 50
: 50

Reel