TE Connectivity Mezalok High-Speed Low-Force XMC Connectors
TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilize a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and are available in various positions and stack heights.The connectors are available in 60, 114, and 320 positions in 6-row configurations with stack height options of 10mm, 12mm, 17mm, and 18mm. These High-Speed Low-Force XMC Connectors also feature a wide -55°C to +125°C operating temperature range, excellent thermal stability, and data rates to +32Gb/s with VITA 42.3 pinout.
Features
- Capable of +32Gb/s speeds with VITA 42.3 pinout
- 47% unmating force reduction, 32% reduction in mating force
- Rugged dual point contact system
- Maintains ball grid array (BGA) PCB attachment, supports standard surface mount processing
- Designed for highly rugged performance ratings, meets legacy Mezalok specifications
- Testing to VITA 72 working group environment
- Compliant with VITA 61 and 42 standards, Mezalok High-Speed Low-Force socket assemblies are intermateable with legacy Mezalok pin connectors allowing ease of upgrade
- Thermal stability for reliable solder joints
- Multiple positions and stack heights available
Applications
- Aircraft
- Ground vehicles
- Sea
- Space
- Missile defense
Specifications
- 250VAC voltage rating
- 1.5A current rating
- 32Gbps maximum data rate
- -55°C to +125°C operating temperature range
- Vertical mounting angle
- 60, 114, or 320 positions and 6 rows
- 1.27mm pitch
- 10mm, 12mm, 17mm, and 18mm stacking heights
- Liquid Crystal Polymer (LCP) housing material
- Gold-plated copper contacts
Published: 2021-11-02
| Updated: 2022-07-07
