onsemi NTMFSC1D6N06CL Dual Cool™ N-Ch MOSFETs

onsemi NTMFSC1D6N06CL Dual Cool™ N-Ch MOSFETs are produced using the advanced Power Trench® process. The NTMFSC1D6N06CL MOSFETs have improved thermal dissipation through the top and bottom sides of the package. The NTMFSC1D6N06CL combines silicon and Dual Cool package technologies to provide the lowest rDS(on) while maintaining excellent switching performance by extremely low junction-to-ambient thermal resistance.

Features

  • Advanced dual-sided cooled packaging
  • Ultra-low RDS(on)
  • MSL1 robust packaging design

Applications

  • Oring FET/load switching
  • Synchronous rectifiers
  • DC-DC conversion
Published: 2019-11-07 | Updated: 2024-02-02