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Melexis MLX75026 QVGA Time-of-Flight Image Sensors

Melexis MLX75026 QVGA Time-of-Flight Image Sensors features DepthSense® pixel, integrated microlenses, and backside illumination (BSI technology). These sensors are combined with a modulated light source is capable of measuring object distance under extreme background light conditions. The MLX75026 sensors include per-phase statistics, diagnostics, continuous or triggered operation modes, and configurable over I2C. The MLX75026 sensors operate at -40°C to 105°C temperature range and -0.3V to 3.3V voltage range. These image sensors are available in a cost-optimized encapsulated package and offer a variety of integration possibilities. These sensors are ideal for use in an automotive and non-automotive application that includes gesture recognition, driver monitoring, skeleton tracking, people or obstacle detection, and traffic monitoring.

Features

  • Quarter Video Graphics Array (QVGA) (320 x 240) pixel array
  • 10µm x 10µm DepthSense® pixels
  • Integrated microlenses
  • Backside illumination (BSI technology)
  • 51% (850nm) external quantum efficiency 
  • 28% (940nm) external quantum efficiency
  • Up to 100MHz high distance accuracy
  • 85% (40 MHz) AC Demodulation contrast
  • 78% (100 MHz) AC Demodulation contrast
  • Differential light source control with phase delay feedback loop
  • 180 FPS maximum full resolution distance framerate
  • Up to 8 raw phases (or quads) per frame
  • Per-phase statistics & diagnostics
  • Continuous or triggered operation mode(s)
  • Up to 400kHz configurable over I2C
  • CSI-2 serial data output, MIPI D-PHY, 1 clock lane, 2 or 4 data lanes (<960 Mbps/lane)
  • Built-in temperature sensor
  • Region of interest (ROI) selection
  • Integrated support for binning (2x2, 4x4, 8x8)
  • Horizontal mirror & vertical flip image modes
  • MSL level 3 rated
  • AEC-Q100 qualified (grade 2)

Applications

  • Gesture recognition
  • Driver monitoring
  • Skeleton tracking
  • People or obstacle detection
  • Traffic monitoring

Specifications

  • 9.2mm x 7.8mm x 1mm encapsulated BGA package
  • 80 pins
  • -0.3V to 3.3V analog/digital supply voltage range
  • Temperature ranges
    • -40°C +105°C operating
    • -40°C +125°C storage

Videos

System Architecture

Block Diagram - Melexis MLX75026 QVGA Time-of-Flight Image Sensors

Block Diagram

Block Diagram - Melexis MLX75026 QVGA Time-of-Flight Image Sensors

Selection Guide

Application Notes

Additional Resources

Published: 2020-10-14 | Updated: 2022-06-16