KEMET C0G Capacitors with KONNEKT™ Technology
KEMET C0G Capacitors with KONNEKT™ Technology feature an operating temperature up to +125°C, 10V to 3000V voltage range, and up to 2.0µF capacitance. KONNKET's high-density packaging technology utilizes an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface-mount multi-chip solution for high-density packaging. Due to their high-temperature tolerance, these C0G capacitors can be mounted close to fast-switching semiconductors in high-power density applications that require minimal cooling. KEMET C0G Capacitors with KONNEKT Technology are ideal for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.
Features
- Commercial and automotive-grade (AEC-Q200)
- High-power density and ripple current capability
- Low equivalent series resistance (ESR)
- Low equivalent series inductance (ESL)
- No capacitance shift with voltage
- Low loss orientation option for higher current handling capability
- -55°C to +125°C operating temperature range
- 0.78nF to 2.0µF capacitance range
- 10VDC to 3000VDC voltage ratings
- EIA sizes 1206, 1210, 1812, and 2220
- Up to 5.1mm thickness
- No piezoelectric noise
- High thermal stability
- Surface-mountable using standard MLCC reflow profiles
- Lead free and RoHS compliant
Applications
- Wide bandgap (WBG), silicon carbide (SiC), and gallium nitride (GaN) systems
- EV/HEV (drive systems, charging)
- Wireless charging
- Photovoltaic systems
- Power converters
- Inverters
- DC Link
- LLC resonant converters
- Snubbers
Performance Graphs
Related Products
KEMET KONNEKT™ High-Density Packaging Technology
Allows components to be bonded together without the use of metal frames.
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KEMET Power Conversion Solutions
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