+ 105 C Memory ICs

Results: 1.584
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Interface Type
Infineon Technologies S70FS01GSDSBHV210
Infineon Technologies NOR Flash NOR Non-Stocked Lead-Time 19 Weeks
Min.: 1
Mult.: 1

NOR Flash SMD/SMT 1 Gbit SPI
Infineon Technologies S70KL1283DPBHV020
Infineon Technologies DRAM SPCM Lead-Time 26 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT 128 Mbit
Infineon Technologies S79FL256SDSMFBG03
Infineon Technologies NOR Flash IC 256 Mb FLASHMEM Non-Stocked Lead-Time 19 Weeks
Min.: 1.450
Mult.: 1.450
: 1.450

NOR Flash SMD/SMT SOIC-16 256 Mbit SPI
Infineon Technologies S79FL256SDSMFBG00
Infineon Technologies NOR Flash IC 256 Mb FLASHMEM Non-Stocked Lead-Time 19 Weeks
Min.: 2.400
Mult.: 2.400

NOR Flash SMD/SMT SOIC-16 256 Mbit SPI
Infineon Technologies S79FL512SDSMFBG01
Infineon Technologies NOR Flash STD SPI Non-Stocked Lead-Time 19 Weeks
Min.: 1
Mult.: 1

NOR Flash SMD/SMT 512 Mbit SPI
AP Memory APS256XXN-OBX9-BG
AP Memory DRAM IoT RAM 256Mb OPI (x8,x16) DDR 250MHz, 1.8V, Ext.. Temp., BGA24 Non-Stocked Lead-Time 20 Weeks
Min.: 4.800
Mult.: 4.800

DRAM SMD/SMT BGA-24 256 Mbit
Macronix MX25U6432FBBJ02-TR
Macronix NOR Flash Serial NOR 1.8V 64Mbit x4 I/O WLCSP-14 +105C Non-Stocked Lead-Time 52 Weeks
Min.: 6.000
Mult.: 6.000
: 6.000
NOR Flash SMD/SMT WLCSP-14 64 Mbit SPI
Alliance Memory DRAM 1G 1.35V 800MHz 64Mx16 DDR3 A-Temp Non-Stocked Lead-Time 12 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

DRAM SMD/SMT FBGA-96 1 Gbit
Avalanche Technology MRAM Avalanche High Performance Serial P-SRAM 16Mb in WSON8 package with QSPI - 108MHz interface, 3V, -40 C to 105 C Non-Stocked Lead-Time 4 Weeks
Min.: 1.365
Mult.: 455

MRAM SMD/SMT WSON-8 16 Mbit QSPI
Avalanche Technology MRAM Non-Stocked Lead-Time 4 Weeks
Min.: 1.008
Mult.: 168
MRAM SMD/SMT FBGA-48 4 Mbit Parallel
ISSI DRAM 64M, 3.3V, 143Mhz 2Mx32 SDR SDRAM Non-Stocked Lead-Time 10 Weeks
Min.: 240
Mult.: 240

DRAM SMD/SMT BGA-90 64 Mbit
Zentel Japan DRAM DDR2 512Mb, 32Mx16, 800 at CL5, 1.8V, FBGA-84, 105C Non-Stocked Lead-Time 20 Weeks
Min.: 2.000
Mult.: 2.000

DRAM SMD/SMT FPGA-84 512 Mbit
Zentel Japan DRAM DDR2 1Gb, 64Mx16, 800 at CL5, 1.8V, FBGA-84, 105C Non-Stocked Lead-Time 20 Weeks
Min.: 2.000
Mult.: 2.000

DRAM SMD/SMT FPGA-84 1 Gbit
ISSI NOR Flash 64Mb, 48pin TSOP,3V, RoHS, T&R, Lowest Sector Protected, Uniform Sector Non-Stocked Lead-Time 24 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500
NOR Flash SMD/SMT TSOP-48 64 Mbit Parallel
ISSI NOR Flash 64Mb, 48pin TSOP,3V, RoHS, T&R, Highest Sector Protected, Uniform Sector Non-Stocked Lead-Time 24 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500
NOR Flash SMD/SMT TSOP-48 64 Mbit Parallel
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +115C), 2G, 1.5V, DDR3, 128Mx16, 1600MT/s at 11-11-11, 96 ball BGA (9mm x13mm) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 190
Mult.: 190
DRAM SMD/SMT BGA-96 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM 1333MT/s 64MX16 DDR3 SDRAM with ECC Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-96 1 Gbit

ISSI SRAM 128Mb, HyperRAM, 16Mbx8, 1.8V, 200MHz, 24-ball TFBGA, RoHS, Automotive Non-Stocked Lead-Time 20 Weeks
Min.: 480
Mult.: 480

SRAM SMD/SMT TFBGA-24 128 Mb
ISSI NOR Flash 64Mb QPI/QPI/QSPI, 8-pin WSON 5X6MM, RoHS, T&R Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1
: 4.500

NOR Flash SMD/SMT WSON-8 64 Mbit QPI, SPI