200 MHz 0 C Memory ICs

Types of Memory ICs

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Results: 571
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Interface Type
GSI Technology SRAM 1.8/2.5V 256K x 32 8M Non-Stocked
Min.: 66
Mult.: 66
No
SRAM SMD/SMT BGA-165 9 Mbit Parallel
GSI Technology SRAM 2.5 or 3.3V 256K x 36 9M Non-Stocked
Min.: 1
Mult.: 1
No
SRAM SMD/SMT BGA-119 9 Mbit Parallel
GSI Technology SRAM 1.8/2.5V 256K x 36 9M Non-Stocked
Min.: 42
Mult.: 42
No
SRAM SMD/SMT BGA-119 9 Mbit Parallel
GSI Technology SRAM 2.5 or 3.3V 512K x 18 9M Non-Stocked
Min.: 1
Mult.: 1
No
SRAM SMD/SMT BGA-119 9 Mbit Parallel
GSI Technology SRAM 1.8/2.5V 512K x 18 9M Non-Stocked
Min.: 42
Mult.: 42
No
SRAM SMD/SMT BGA-119 9 Mbit Parallel
GSI Technology SRAM 2.5 or 3.3V 512K x 18 9M Non-Stocked
Min.: 1
Mult.: 1
No
SRAM SMD/SMT BGA-165 9 Mbit Parallel
GSI Technology SRAM 1.8/2.5V 512K x 18 9M Non-Stocked
Min.: 66
Mult.: 66
No
SRAM SMD/SMT BGA-165 9 Mbit Parallel
GSI Technology SRAM 2.5 or 3.3V 256K x 36 9M Non-Stocked
Min.: 1
Mult.: 1
No
SRAM SMD/SMT BGA-119 9 Mbit Parallel
GSI Technology SRAM 1.8/2.5V 256K x 36 9M Non-Stocked
Min.: 42
Mult.: 42
No
SRAM SMD/SMT BGA-119 9 Mbit Parallel
GSI Technology SRAM 2.5 or 3.3V 256K x 36 9M Non-Stocked
Min.: 1
Mult.: 1
No
SRAM SMD/SMT BGA-165 9 Mbit Parallel
GSI Technology SRAM 1.8/2.5V 256K x 36 9M Non-Stocked
Min.: 66
Mult.: 66
No
SRAM SMD/SMT BGA-165 9 Mbit Parallel
Infineon Technologies CY7C1370KV33-250AXC
Infineon Technologies SRAM SYNC SRAMS Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SRAM SMD/SMT 18 Mbit Parallel
Infineon Technologies CY7C1372KV33-200AXC
Infineon Technologies SRAM SYNC SRAMS Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SRAM SMD/SMT 18 Mbit Parallel
Alliance Memory DRAM DDR1, 256Mb, 16M x 16, 2.5V, 66pin TSOP II, 200 MHz, Commercial Temp (A), TAPE & REEL Non-Stocked Lead-Time 8 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

DRAM SMD/SMT TSOP-II-66 256 Mbit
Alliance Memory DRAM DDR1, 512Mb, 32M X 16, 2.5V, 66pin TSOP II, 200 MHz, Commercial Temp A Tape and Reel Non-Stocked Lead-Time 6 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

DRAM SMD/SMT TSOP-II-66 512 Mbit
Alliance Memory DRAM DDR1, 128Mb, 8M x 16, 2.5V, 66pin TSOP II, 200 MHz, Commercial Temp A Die, T&R Non-Stocked Lead-Time 6 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

DRAM SMD/SMT TSOP-II-66 128 Mbit
Alliance Memory DRAM DDR1, 512Mb, 32M X 16, 2.5V, 60-ball BGA, 200 MHz, Commercial Temp - Tray Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT TFBGA-60 512 Mbit
Alliance Memory DRAM DDR1, 512Mb, 32M X 16, 2.5V, 60-ball BGA, 200 MHz, Commercial Temp - Tape & Reel Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT TFBGA-60 512 Mbit
Alliance Memory DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tray Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-60 512 Mbit
Alliance Memory DRAM DDR1, 512Mb, 64M x 8, 2.5v, 60ball TFBGA, 200MHz, Commercial Temp - Tape & Reel Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT FBGA-60 512 Mbit
Zentel Japan DRAM DDR1 512Mb, 32Mx16, 200MHz at CL3, 2.5V, TSOPII-66 Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

DRAM SMD/SMT TSOP-II-66 512 Mbit
ISSI SRAM 4Mb,Pipeline,Sync with ECC,128K x 36,200Mhz,3.3v I/O,100 Pin TQFP, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

SRAM SMD/SMT TQFP-100 4 Mbit Parallel
ISSI SRAM 4Mb, 3.3v, 200Mhz 128K x 36 Sync SRAM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SRAM SMD/SMT TQFP-100 4 Mbit Parallel
ISSI SRAM 4Mb,Pipeline,Sync with ECC,256K x 18,200Mhz,3.3v I/O,100 Pin TQFP, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

SRAM SMD/SMT TQFP-100 4 Mbit Parallel
ISSI SRAM 4Mb, 3.3v, 200Mhz 256K x 18 Sync SRAM Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SRAM SMD/SMT TQFP-100 4 Mbit Parallel