16 bit SMD/SMT Memory ICs

Results: 1.645
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Interface Type
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96 Non-Stocked Lead-Time 16 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3L 4Gb, 256Mx16, 2133 at CL14, 1.35V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3L 8Gb, 512Mx16 (1CS, 1ZQ), 1600 at CL11, 1.35V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 1.900
Mult.: 1.900

DRAM SMD/SMT FPGA-96 8 Gbit
ISSI DRAM 16G, 1.35V, DDR3L, 1Gx16,1600MT/s at 11-11-11, 96 ball BGA (10mm x 14mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000
DRAM SMD/SMT BGA-96 16 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +115C), 2G, 1.5V, DDR3, 128Mx16, 1600MT/s at 11-11-11, 96 ball BGA (9mm x13mm) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 190
Mult.: 190
DRAM SMD/SMT BGA-96 2 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s at 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500
DRAM SMD/SMT BGA-96 4 Gbit
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s at 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-96 4 Gbit
ISSI DRAM 8G, 1.35V, DDR3L, 512Mx16, 1600MT/s at 11-11-11, 96 ball BGA (9mm x 13mm) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 1
Mult.: 1
DRAM SMD/SMT BGA-96 8 Gbit