50 mA Memory ICs

Results: 156
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product Type
Mounting Style
Package/Case
Memory Size
Organisation
Interface Type
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
ISSI DRAM 256M, 3.3V, SDRAM, 16Mx16, 143Mhz, 54 ball BGA (8mmx8mm) RoHS, IT
Datasheet
27.144On Order
Min.: 1
Mult.: 1

DRAM SMD/SMT BGA-54 16 Mbit 1 M x 16 - 40 C + 85 C
ISSI DRAM 256M, 3.3V, SDRAM, 16Mx16, 143Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R
Datasheet
14.770On Order
MouseReel Available
Min.: 1
Mult.: 1
: 2.500

DRAM SMD/SMT BGA-54 16 Mbit 1 M x 16 - 40 C + 85 C Reel, Cut Tape, MouseReel
ISSI DRAM 256M, 3.3V, SDRAM 16Mx16 143MHz
Datasheet
4.968On Order
Min.: 1
Mult.: 1

DRAM SMD/SMT TSOP-II-54 16 Mbit 1 M x 16 0 C + 70 C
ISSI DRAM 256M, 3.3V, SDRAM 16Mx16 143MHz
Datasheet
4.752On Order
Min.: 1
Mult.: 1

DRAM SMD/SMT TSOP-II-54 16 Mbit 1 M x 16 - 40 C + 85 C
Alliance Memory SRAM 1Mb, SRAM, 128K x 8, 5V, 32pin SOJ (300 mil), 12ns, Industrial Temp, Corner Power, D Die, T&R
Datasheet
1.000Expected 10/22/2026
Min.: 1
Mult.: 1
: 1.000

SRAM SMD/SMT SOJ-32 1 MB 128 k x 8 - 40 C + 85 C Reel, Cut Tape
ISSI DRAM 256M, 3.3V, SDRAM, 16Mx16, 143Mhz, 54 ball BGA (8mmx8mm) RoHS
Datasheet
696Expected 1/15/2027
Min.: 1
Mult.: 1

DRAM SMD/SMT BGA-54 16 Mbit 1 M x 16 0 C + 70 C Reel
ISSI DRAM 16M, 3.3V, SDRAM 1Mx16, 143Mhz,RoHS
Datasheet
585Expected 9/7/2026
Min.: 1
Mult.: 1

DRAM SMD/SMT TSOP-II-50 16 Mbit 1 M x 16 - 40 C + 85 C Tray
ISSI DRAM 256M, 3.3V, SDRAM, 16Mx16, 143MHz, 54 pin TSOP II RoHS, IT, T&R
Datasheet
1.500On Order
MouseReel Available
Min.: 1
Mult.: 1
: 1.500

DRAM SMD/SMT TSOP-II-54 16 Mbit 1 M x 16 - 40 C + 85 C Reel, Cut Tape, MouseReel
Alliance Memory DRAM 512M 166MHz 16Mx32 Mobile LP SDRAM IT
Datasheet
348Expected 8/26/2026
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-90 512 Mbit 16 M x 32 - 40 C + 85 C Tray

Microchip Technology EEPROM 150NS, PLCC, IND TEMP, GREEN
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 750
Mult.: 750
: 750

EEPROM SMD/SMT PLCC-32 256 kbit 32 k x 8 Parallel - 40 C + 85 C Reel

Microchip Technology EEPROM 256K FAST PROG SDP- 150NS IND TEMP
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 81
Mult.: 27

EEPROM SMD/SMT SOIC-28 256 kbit 32 k x 8 Parallel - 40 C + 85 C Tube

Microchip Technology EEPROM 150NS, PLCC, IND TEMP, GREEN
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 750
Mult.: 750
: 750

EEPROM SMD/SMT PLCC-32 256 kbit 32 k x 8 Parallel - 40 C + 85 C Reel

Microchip Technology EEPROM 150NS, SOIC, IND TEMP, GREEN
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

EEPROM SMD/SMT SOIC-28 256 kbit 32 k x 8 Parallel - 40 C + 85 C Reel
Microchip Technology EEPROM 256K 11MIL GRIND - 150NS PGA 883C
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 20
Mult.: 20

EEPROM SMD/SMT PGA-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Bulk

Microchip Technology EEPROM 150NS CERDIP
Datasheet
Lead-Time 23 Weeks
Min.: 1
Mult.: 1

EEPROM Through Hole DIP-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube

Microchip Technology EEPROM 200NS CERDIP
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 14
Mult.: 14

EEPROM Through Hole DIP-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube

Microchip Technology EEPROM 250NS CERDIP
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 14
Mult.: 14

EEPROM Through Hole DIP-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube
Microchip Technology EEPROM 256K HI-ENDURANCE SDP- 150NS 883C
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 14
Mult.: 14

EEPROM Through Hole CDIP-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube
Microchip Technology EEPROM 256K 11MIL GRIND - 200NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 1
Mult.: 1

EEPROM SMD/SMT LCC-32 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube
Microchip Technology EEPROM 256K 11MIL GRIND - 200NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 20
Mult.: 20

EEPROM SMD/SMT PGA-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Bulk
Microchip Technology EEPROM 256K 11MIL GRIND - 250NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 34
Mult.: 34

EEPROM SMD/SMT LCC-32 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube
Microchip Technology EEPROM 256K 11MIL GRIND - 250NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 20
Mult.: 20

EEPROM SMD/SMT PGA-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Bulk
Microchip Technology EEPROM 256K HI-ENDURANCE SDP - 150NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 34
Mult.: 34

EEPROM SMD/SMT LCC-32 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube
Microchip Technology EEPROM 256K HI-ENDURANCE SDP - 150NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 20
Mult.: 20

EEPROM SMD/SMT PGA-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Bulk
Microchip Technology EEPROM 256K HI-ENDURANCE SDP - 200NS
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 14
Mult.: 14

EEPROM Through Hole CDIP-28 256 kbit 32 k x 8 Parallel - 55 C + 125 C Tube