4 Gbit Memory ICs

Types of Memory ICs

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Results: 291
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Organisation Interface Type Minimum Operating Temperature Maximum Operating Temperature Packaging
GigaDevice GD9FS4G8F4DMGI
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel - 40 C + 85 C Tray
GigaDevice GD9FU4G8F3ALGJ
GigaDevice NAND Flash Non-Stocked
Min.: 2.100
Mult.: 2.100

NAND Flash SMD/SMT FBGA-63 4 Gbit Parallel Tray
GigaDevice GD9FU4G8F3AMG2
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel Tray
GigaDevice GD9FU4G8F3AMGJ
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel Tray
GigaDevice GD9FU4G8F4DLGI
GigaDevice NAND Flash Non-Stocked
Min.: 2.100
Mult.: 2.100

NAND Flash SMD/SMT FBGA-63 4 Gbit Parallel - 40 C + 85 C Tray
GigaDevice GD9FU4G8F4DMGI
GigaDevice NAND Flash Non-Stocked
Min.: 960
Mult.: 960

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel - 40 C + 85 C Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78 Non-Stocked Lead-Time 16 Weeks
Min.: 2.420
Mult.: 2.420

DRAM SMD/SMT FPGA-78 4 Gbit 512 M x 8 0 C + 95 C Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 2.420
Mult.: 2.420

DRAM SMD/SMT FPGA-78 4 Gbit 512 M x 8 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78 Non-Stocked Lead-Time 24 Weeks
Min.: 2.420
Mult.: 2.420

DRAM SMD/SMT FPGA-78 4 Gbit 512 M x 8 0 C + 95 C Tray
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
Min.: 2.420
Mult.: 2.420

DRAM SMD/SMT FPGA-78 4 Gbit 512 M x 8 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3L 4Gb, 512Mx8, 2133 at CL14, 1.35V, FBGA-78 Non-Stocked Lead-Time 24 Weeks
Min.: 2.420
Mult.: 2.420

DRAM SMD/SMT FPGA-78 4 Gbit 512 M x 8 0 C + 95 C Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96 Non-Stocked Lead-Time 16 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit 256 M x 16 0 C + 95 C Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit 256 M x 16 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit 256 M x 16 0 C + 95 C Tray
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit 256 M x 16 - 40 C + 95 C Tray
Zentel Japan DRAM DDR3L 4Gb, 256Mx16, 2133 at CL14, 1.35V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

DRAM SMD/SMT FPGA-96 4 Gbit 256 M x 16 0 C + 95 C Tray
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s at 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500
DRAM SMD/SMT BGA-96 4 Gbit 256 M x 16 0 C + 95 C Reel
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s at 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-96 4 Gbit 256 M x 16 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 105 C Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 105 C Tray
ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI NAND Flash 4Gb (x8, 4bit ECC), TSOP-48, 3V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

NAND Flash SMD/SMT TSOP-I-48 4 Gbit 512 M x 8 Parallel - 40 C + 85 C Reel