ISSI Memory ICs

Types of Memory ICs

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Results: 2.908
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Type Mounting Style Package/Case Memory Size Organisation Interface Type Minimum Operating Temperature Maximum Operating Temperature Packaging
ISSI NOR Flash 128Mb QPI/QSPI, 8-pin WSON 6X8MM, RoHS, T&R Non-Stocked Lead-Time 30 Weeks
Min.: 4.000
Mult.: 4.000
: 4.000

NOR Flash SMD/SMT WSON-8 128 Mbit 16 M x 8 QPI, SPI - 40 C + 105 C Reel

ISSI NOR Flash 128Mb QPI/QSPI, 16-pin SOP 300Mil, RoHS, T&R Non-Stocked Lead-Time 30 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

NOR Flash SMD/SMT SOIC-16 128 Mbit 16 M x 8 QPI, SPI - 40 C + 105 C Reel

ISSI NOR Flash 256Mb, Octal Flash, 1.8V, 24-ball TFBGA, RoHS, IT, T&R Non-Stocked Lead-Time 24 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

NOR Flash SMD/SMT TFBGA-24 256 Mbit SPI - 40 C + 125 C Reel
ISSI DRAM Automotive (Tc: -40 to +115C), 2G, 1.5V, DDR3, 128Mx16, 1600MT/s at 11-11-11, 96 ball BGA (9mm x13mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500
DRAM SMD/SMT BGA-96 2 Gbit 128 M x 16 - 40 C + 105 C Reel

ISSI SRAM 256Mb, OctalRAM, 32Mbx8, 1.8V, 200MHz, 24-ball TFBGA, RoHS, Automotive Non-Stocked Lead-Time 18 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SRAM SMD/SMT TFBGA-24 256 Mb 32 M x 8 OPI - 40 C + 105 C Reel
ISSI DRAM 128M, 2.5V, Mobile SDRAM, 8Mx16, 133Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-54 Reel
ISSI DRAM 128M, 2.5V, Mobile SDRAM, 4Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-90 Reel
ISSI DRAM 128M, 3.3V, Mobile SDRAM, 8Mx16, 166Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-54 Reel
ISSI DRAM 128M, 3.3V, Mobile SDRAM, 8Mx16, 133Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-54 Reel
ISSI DRAM 128M, 3.3V, Mobile SDRAM, 4Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-90 128 Mbit 4 M x 32 - 40 C + 85 C Reel
ISSI DRAM 128M, 1.8V, Mobile SDRAM, 8Mx16, 133Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-54 Reel
ISSI DRAM 128M, 1.8V, Mobile SDRAM, 4Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-90 Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 105 C Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 105 C Tray
ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 4 Gbit 128 M x 32 - 40 C + 95 C Reel
ISSI NAND Flash 4Gb (x8, 4bit ECC), TSOP-48, 3V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

NAND Flash SMD/SMT TSOP-I-48 4 Gbit 512 M x 8 Parallel - 40 C + 85 C Reel
ISSI NAND Flash 4Gb (x8, 4bit ECC), TSOP-48, 1.8V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel - 40 C + 85 C Reel
ISSI NAND Flash 4Gb (x8, 8bit ECC), TSOP-48, 3V, RoHS, IT, T&R, , AutoGrade Non-Stocked Lead-Time 52 Weeks
Min.: 1.500
Mult.: 1.500
: 1.500

NAND Flash SMD/SMT VFBGA-63 4 Gbit 512 M x 8 Parallel - 40 C + 105 C Reel
ISSI NAND Flash 4Gb (x16, 8bit ECC), 63 Ball VFBGA, 3V, RoHS, IT, T&R, AutoGrade Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

NAND Flash SMD/SMT VFBGA-63 4 Gbit 256 M x 16 Parallel - 40 C + 105 C Reel

ISSI NAND Flash 2Gb, 8bit ECC, 24-ball TFBGA 6x8x1.2 mm, 3.3V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

NAND Flash SMD/SMT TFBGA-24 2 Gbit 256 M x 8 SPI - 40 C + 85 C Reel
ISSI NAND Flash 2Gb, 8bit ECC, 8-contact WSON 8x6mm, 3.3V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 4.000
Mult.: 4.000
: 4.000

NAND Flash SMD/SMT WSON-8 2 Gbit 256 M x 8 SPI - 40 C + 85 C Reel

ISSI NAND Flash 1Gb, 8bit ECC, 24-ball TFBGA 6x8x1.2 mm, 1.8V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

NAND Flash SMD/SMT TFBGA-24 1 Gbit 64 M x 16 SPI - 40 C + 85 C Reel