16 MHz RF System on a Chip - SoC

Results: 12
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Core Operating Frequency Maximum Data Rate Output Power Sensitivity Supply Voltage - Min Supply Voltage - Max Supply Current Receiving Supply Current Transmitting Program Memory Size Minimum Operating Temperature Maximum Operating Temperature Package/Case Packaging
Renesas / Dialog RF System on a Chip - SoC BT5.0 QFN40 SoC 23.809In Stock
Min.: 1
Mult.: 1
: 5.000

BLE 5.0 ARM Cortex M0 2.4 GHz 1 Mbps 0 dBm - 93 dBm 1.7 V 3.6 V 3.7 mA 3.4 mA 64 kB, 128 kB, 2 MB - 40 C + 85 C QFN-40 Reel, Cut Tape
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 32 GPIOs in QFN48 and 0.4mm pin pitch package 7.866In Stock
Min.: 1
Mult.: 1
: 4.000

Bluetooth ARM Cortex M0 2.4 GHz 0 dBm - 93 dBm 2.35 V 3.3 V 3.7 mA 3.4 mA 32 kB, 84 kB - 40 C + 85 C QFN-48 Reel, Cut Tape, MouseReel
Renesas / Dialog RF System on a Chip - SoC BT5.0 WL-CSP34 SoC 1.373In Stock
Min.: 1
Mult.: 1
: 7.500

BLE 5.0 ARM Cortex M0 2.4 GHz 1 Mbps 0 dBm - 93 dBm 900 mV 3.6 V 3.7 mA 3.4 mA 64 kB, 128 kB - 40 C + 85 C WLCSP-34 Reel, Cut Tape
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, memories and peripherals 24 GPIOs in QFN40 and 0.4mm pin pitch package 3.514In Stock
Min.: 1
Mult.: 1
: 5.000

Bluetooth ARM Cortex M0 2.4 GHz 0 dBm - 93 dBm 2.35 V 3.3 V 3.7 mA 3.4 mA 32 kB, 84 kB - 40 C + 85 C QFN-40 Reel, Cut Tape, MouseReel
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch package 5.000In Stock
Min.: 1
Mult.: 1
: 5.000

Bluetooth ARM Cortex M0 2.4 GHz 0 dBm - 93 dBm 900 mV 3.3 V 3.7 mA 3.4 mA 32 kB, 84 kB - 40 C + 85 C WLCSP-34 Reel, Cut Tape, MouseReel
Renesas / Dialog RF System on a Chip - SoC BT5.0 QFN40 SoC 1.662In Stock
Min.: 1
Mult.: 1
: 5.000

BLE 5.0 ARM Cortex M0 2.4 GHz 1 Mbps 0 dBm - 93 dBm 900 mV 3.6 V 3.7 mA 3.4 mA 64 kB, 128 kB - 40 C + 85 C QFN-40 Reel, Cut Tape
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.3 SoC with integrated ARM Cortex-M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package 2.037In Stock
Min.: 1
Mult.: 1
: 4.000

a Low Power Bluetooth 5.3 SoC ARM Cortex M0+ 1.8 V 3.6 V - 40 C + 105 C QFN-24 Reel, Cut Tape, MouseReel
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch package Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1
: 5.000

Bluetooth ARM Cortex M0 2.4 GHz 0 dBm - 93 dBm 2.35 V 3.3 V 3.7 mA 3.4 mA 32 kB, 84 kB - 40 C + 85 C WLCSP-34 Reel, Cut Tape, MouseReel
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC optimized for A4WP and HCI applications 24 GPIOs in QFN40 and 0.4mm pin pitch package Non-Stocked Lead-Time 36 Weeks
Min.: 5.000
Mult.: 5.000
: 5.000

Bluetooth ARM Cortex M0 2.4 GHz 0 dBm - 93 dBm 3.3 V 3.3 V 3.7 mA 3.4 mA 32 kB - 40 C + 85 C QFN-40 Reel
Renesas / Dialog DA14530-00000FX2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1
: 4.000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.3 V 5 mA 9 mA 32 kB - 40 C + 85 C FCGQFN-24 Reel, Cut Tape
Renesas / Dialog DA14531-01000FX2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1
: 4.000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.6 V 2.2 mA 3.5 mA 32 kB - 40 C + 85 C FCGQFN-24 Reel, Cut Tape
Renesas / Dialog DA14531-01000OG2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package Non-Stocked Lead-Time 36 Weeks
Min.: 1
Mult.: 1
: 4.000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.6 V 2.2 mA 3.5 mA 32 kB - 40 C + 85 C WLCSP-17 Reel, Cut Tape