3.5 ns Memory ICs

Types of Memory ICs
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Results: 43
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product Type
Mounting Style
Package/Case
Memory Size
Organisation
Interface Type
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
ISSI DRAM 16G, 1.06-1.17/1.70-1.95V, LPDDR4, 512Mx32, 1866MHz, 200 ball BGA (10mmx14.5mm) RoHS
Datasheet
680On Order
Min.: 1
Mult.: 1

DRAM SMD/SMT BGA-299 16 Gbit 512 M x 32 - 40 C + 95 C Tray
ISSI DRAM 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1866MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
131On Order
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 4 Gbit 256 M x 16 - 40 C + 95 C
ISSI DRAM 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1866MHz, 200 ball BGA (10mmx14.5mm) RoHS
Datasheet
136Expected 12/14/2026
Min.: 1
Mult.: 1

DRAM SMD/SMT FBGA-200 8 Gbit 256 M x 32 - 40 C + 95 C
SMART Modular Technologies DRAM LPDDR4 16Gb 51 2Mx32 1.1V 4267Mbps 200-ball BGA Ind Distributed-Sold by SMART
Datasheet
Non-Stocked Lead-Time 13 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000

DRAM SMD/SMT FBGA-200 16 Gbit 512 M x 32 - 40 C + 105 C Reel
Renesas Electronics SRAM 4M X36 3.3V I/O SLOW ZBT
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 136
Mult.: 136

SRAM SMD/SMT CABGA-165 4 Mbit 128 k x 36 Parallel - 40 C + 85 C Tray
Renesas Electronics SRAM 128Kx36 SYNC 3.3V PIPELINED BURST SRAM
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 144
Mult.: 72

SRAM SMD/SMT TQFP-100 4 Mbit 128 k x 36 Parallel - 40 C + 85 C Tray
Renesas Electronics SRAM 4M X36 3.3V I/O SLOW ZBT
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

SRAM SMD/SMT CABGA-165 4 Mbit 128 k x 36 Parallel - 40 C + 85 C Reel
Renesas Electronics SRAM 128Kx36 Synch 3.3V PipeLined Burst SRAM
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

SRAM SMD/SMT CABGA-165 4 Mbit 128 k x 36 Parallel - 40 C + 85 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 512Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

DRAM SMD/SMT BGA-200 8 Gbit 512 M x 16 - 40 C + 105 C Reel
ISSI SRAM 9Mb,Pipeline,Sync,256K x 36,166Mhz,3.3v I/O,100 Pin TQFP, RoHS, Automotive temp
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

SRAM SMD/SMT TQFP-100 9 Mbit - 40 C + 125 C Reel
ISSI SRAM 36M (1Mx36) 166MHz Sync SRAM 2.5v
Datasheet
Non-Stocked
Min.: 72
Mult.: 72

SRAM SMD/SMT TQFP-100 36 Mbit 1 M x 36 Parallel 0 C + 70 C Tube
ISSI SRAM 36M (1Mx36) 166MHz Sync SRAM 2.5v
Datasheet
Non-Stocked
Min.: 800
Mult.: 800
: 800

SRAM SMD/SMT TQFP-100 36 Mbit 1 M x 36 Parallel 0 C + 70 C Reel
Alliance Memory AS4C128M16MD4V-062BAN
Alliance Memory DRAM LPDDR4X, 2Gb, 128M x 16, 0.6V, 200ball TFBGA, 1600MHZ, ECC, AUTO TEMP - Tray
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 680
Mult.: 136

DRAM SMD/SMT FBGA-200 2 Gbit 128 M x 16 - 40 C + 105 C Tray
Alliance Memory AS4C256M16MD4V-062BAN
Alliance Memory DRAM LPDDR4X, 4Gb, 256M x 16, 0.6V, 200ball TFBGA, 1600MHZ, ECC, AUTO TEMP
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 680
Mult.: 136

DRAM SMD/SMT FBGA-200 4 Gbit 256 M x 16 - 40 C + 105 C Tray
Alliance Memory AS4C64M32MD4-062BAN
Alliance Memory DRAM LPDDR4, 2G, 64M x 32, 1.1V, 200 BALL TFBGA, 1600MHZ, ECC, Automotive Temp - Tray
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 680
Mult.: 136

DRAM SMD/SMT FBGA-200 2 Gbit 64 M x 32 - 40 C + 105 C Tray
Alliance Memory AS8C161831-QC166N
Alliance Memory SRAM SYNC SRAM, 18Mb, 1M x 18, ZBT(Pipelined), 2.5V, 166MHz, 100TQFP - Tray
Datasheet
Non-Stocked
Min.: 100
Mult.: 100

SRAM SMD/SMT TQFP-100 18 Mbit 1 M x 18 Parallel 0 C + 70 C Tray
Alliance Memory AS4C512M16MD4V-053BIN
Alliance Memory DRAM LPDDR4X, 8Gb, 512M x 16, 0.6V, 200-ball TFBGA, 1866MHZ, INDUSTRIAL TEMP - Tray
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1
DRAM SMD/SMT FBGA-200 8 Gbit 512 M x 16 - 40 C + 95 C Tray
Alliance Memory AS4C512M32MD4V-053BIN
Alliance Memory DRAM LPDDR4X, 16Gb, 512M x 32, 0.6V, 200ball TFBGA, 1866MHZ, INDUSTRIAL TEMP - Tray
Datasheet
Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1
DRAM SMD/SMT FBGA-200 16 Gbit 512 M x 32 - 40 C + 95 C Tray