1.71 V Embedded Solutions

Types of Embedded Solutions

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Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Avalanche Technology MRAM Non-Stocked
Min.: 4.000
Mult.: 4.000
: 4.000
ISSI SRAM 36Mb 2Mbx18 250Mhz QUAD Sync SRAM Non-Stocked
Min.: 105
Mult.: 105

ISSI SRAM 36M (1Mx36) 250Mhz QUAD Sync SRAM Non-Stocked
Min.: 105
Mult.: 105

ISSI SRAM 36M (2Mx18) 250Mhz QUAD Sync SRAM Non-Stocked
Min.: 105
Mult.: 105

Quectel Bluetooth Modules - 802.15.1 Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

Quectel Bluetooth Modules - 802.15.1 Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1
Quectel Sub-GHz Modules wM-Bus, 433MHz, with SAW (used to reduce interference from cellular) Non-Stocked Lead-Time 10 Weeks
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Wi-Fi 6 (802.11ax), 2.4/5 GHz Dual-Band 1x1 + BT 5.2 + 802.15.4 Tri-Radio, Higher performance for Wi-Fi 4 and 6
Non-Stocked Lead-Time 24 Weeks
Min.: 500
Mult.: 500
: 500
Quectel Bluetooth Modules - 802.15.1 BT 5.4 & BLE Mesh, 20 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 250
: 250

Quectel Bluetooth Modules - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 250
: 250

Quectel Bluetooth Modules - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
Quectel Bluetooth Modules - 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, RF antenna connector Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
Quectel Bluetooth Modules - 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105?
Non-Stocked Lead-Time 18 Weeks
Min.: 500
Mult.: 500
: 500
Quectel Bluetooth Modules - 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power = 8 dBm, -40 C to +85 C Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax Non-Stocked Lead-Time 16 Weeks
Min.: 1.000
Mult.: 1.000
: 1.000
Quectel Sub-GHz Modules wM-Bus, 868MHz, with SAW (used to reduce interference from cellular) Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
Quectel Sub-GHz Modules wM-Bus, 868MHz, w/o SAW Non-Stocked Lead-Time 16 Weeks
Min.: 500
Mult.: 500
: 500
ISSI SRAM 72Mb, DDR II (Burst of 2) CIO, Sync SRAM, 2M x 36, 165 Ball FBGA (13x15 mm), RoHS

ISSI SRAM 72Mb 300Mhz 2Mx36 DDR-II Sync SRAM

ISSI SRAM 72Mb, DDR II (Burst of 2) CIO, Sync SRAM, 4M x 18, 165 Ball FBGA (15x17 mm), RoHS

ISSI SRAM 72Mb, DDR II (Burst of 2) CIO, Sync SRAM, 4M x 18, 165 Ball FBGA (13x15 mm), RoHS

ISSI SRAM 36Mb, DDR II (Burst of 2) CIO, Sync SRAM, 2M x 18, 165 Ball FBGA (13x15 mm), RoHS