C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

Results: 485
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Number of Positions Pitch Number of Rows Row Spacing Mounting Style Termination Style Mounting Angle Contact Gender Contact Plating Mating Post Length Termination Post Length Series Tradename Application Wire Gauge Minimum Operating Temperature Maximum Operating Temperature Packaging
Molex Headers & Wire Housings C-Grid SR Vt Pn 6.75 .75/2.90mm Au-F 4Ck 3.035In Stock
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Headers Breakaway 4 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90120 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 40P R/A SR TIN 908In Stock
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Headers Breakaway 40 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 2P R/A SR SEL AU 5.735In Stock
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Headers Breakaway 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90121 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 4P R/A DR TIN 4.048In Stock
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Mult.: 1

Headers Breakaway 4 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90122 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 8P R/A DR TIN 2.221In Stock
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Mult.: 1

Headers Breakaway 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 90122 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HSG 3P SR W/2POL BTTN 9.322In Stock
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Mult.: 1

Wire Housings Receptacle Housing 3 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90123 C-Grid Wire-to-Board, Signal - 55 C + 105 C Bulk
Molex Headers & Wire Housings 2.54MM CGRIDIII HSG 10P SR W/2POL BTTN 948In Stock
Min.: 1
Mult.: 1

Wire Housings Receptacle Housing 10 Position 2.54 mm (0.1 in) 1 Row Cable Mount / Free Hanging Crimp Socket (Female) 90123 C-Grid Wire-to-Board, Signal - 55 C + 105 C Bulk
Molex Headers & Wire Housings C-GRID III 8 CKT SHR 6.384In Stock
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Mult.: 1

Headers Shrouded 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2x5 HEADER 7.565In Stock
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Mult.: 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 12P V DR SHRD TIN 6.487In Stock
Min.: 1
Mult.: 1

Headers Shrouded 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 6P V DR SHRD AU-E 1.386In Stock
Min.: 1
Mult.: 1

Headers Shrouded 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 14P V DR SHRD AU-E 2.742In Stock
Min.: 1
Mult.: 1

Headers Shrouded 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid - 55 C + 125 C Tray
Molex Headers & Wire Housings C-GRID III 16 CKT SH 2.942In Stock
Min.: 1
Mult.: 1

Headers Shrouded 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 20P V DR SHRD AU-E 4.089In Stock
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Headers Shrouded 20 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 24P V DR SHRD AU-E 778In Stock
2.880Expected 11/19/2026
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Mult.: 1

Headers Shrouded 24 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 30P V DR SHRD AU-E 371In Stock
1.920Expected 10/21/2026
Min.: 1
Mult.: 1

Headers Shrouded 30 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid Shrd Hdr DR V d Hdr DR Vt Au-F 6/ 1.903In Stock
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Mult.: 1

Headers Shrouded 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings C-Grid Shrd Hdr DR V Hdr DR Vt Au-F 10/10 2.620In Stock
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Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings STRT DUAL SHRD 16P fully loaded 971In Stock
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Headers Shrouded 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings HDR 2X03P RA SHRD FULLY LOADED 3.195In Stock
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Headers Shrouded 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings HDR SHROUDED 8P R/A 2.945In Stock
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Headers Shrouded 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 20P R/A DR SHRD TIN 1.732In Stock
Min.: 1
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Headers Shrouded 20 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings 2.54MM CGRIDIII HDR 30P R/A DR SHRD TIN 1.678In Stock
Min.: 1
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Headers Shrouded 30 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings C-GRID III 8 CKT SHR 3.570In Stock
Min.: 1
Mult.: 1

Headers Shrouded 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex Headers & Wire Housings HDR DUAL R/A 10P 1.613In Stock
Min.: 1
Mult.: 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray