Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Results: 85
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Package/Case Material Thermal Conductivity Breakdown Voltage Color Minimum Operating Temperature Maximum Operating Temperature Length Width Thickness Tensile Strength Flammability Rating Series Packaging
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.100" Thickness Drop Dispatch Lead Time 19 Weeks
344,79 €
339,66 €
327,71 €
Min.: 3
Mult.: 1
Gap Fillers / Gap Pads / Sheets Gap Filler Pad Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.120" Thickness Drop Dispatch Lead Time 19 Weeks
438,49 €
435,03 €
Min.: 2
Mult.: 1
Gap Fillers / Gap Pads / Sheets Gap Filler Pad Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.160" Thickness Drop Dispatch Lead Time 16 Weeks
576,71 €
555,48 €
Min.: 2
Mult.: 1
Gap Fillers / Gap Pads / Sheets Gap Filler Pad Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 600CC Cartridge, 3.5 W/m-K, Liqui-Form Drop Dispatch Lead Time 16 Weeks
315,90 €
291,07 €
270,28 €
Min.: 4
Mult.: 1
Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 2796659
Bergquist Company Thermal Interface Products Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form Drop Dispatch Lead Time 8 Weeks
4.694,88 €
Min.: 25
Mult.: 1
TLF 10000
Bergquist Company 3041247
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
258,09 €
254,59 €
244,59 €
Min.: 3
Mult.: 1
TGP 10000ULM
Bergquist Company 3041248
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
335,42 €
309,05 €
284,17 €
Min.: 3
Mult.: 1
TGP 10000ULM
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll
Mouser does not sell this product in your region.
Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll
Mouser does not sell this product in your region.
Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll
Mouser does not sell this product in your region.
Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT