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ATS-59007-C1-R0

Name: Advanced Thermal Solutions ATS-59007-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59007-C1-R0
Price: 23.09 EUR
Availability: OutOfStock

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Mouser No:

984-ATS-59007-C1-R0

Mfr. No:

ATS-59007-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm

Datasheet:

ATS-59007-C1-R0 Datasheet (PDF)

ECAD Model:

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Learn more about Advanced Thermal Solutions ATS-59007-C1-R0

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Snap On
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	2.42 C/W
Length:	46 mm
Width:	35 mm
Height:	16 mm
Type:	Component
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	maxiGRIP HS ASM - Custom
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW maxiGRIP

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Datasheet

ATS-59007-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

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Compliance Codes

TARIC:: 8542900000
CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
MXHTS:: 8542900100
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.