3.3 V RF System on a Chip - SoC

Results: 9
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Core Operating Frequency Maximum Data Rate Output Power Sensitivity Supply Voltage - Min Supply Voltage - Max Supply Current Receiving Supply Current Transmitting Program Memory Size Minimum Operating Temperature Maximum Operating Temperature Package/Case Packaging
Espressif Systems RF System on a Chip - SoC ESP32 is a single 2.4 GHZ Wi-Fi-and-Bluetooth combo chip designed with the TSMC low-power 40 nm technology. It is designed to achieve the best power and RF performance, showing robustness, versatility and reliability in a wide variety of applications 5.000In Stock
5.000Expected 6/24/2026
Min.: 1
Mult.: 1

LX6 2.412 GHz to 2.484 GHz 150 Mb/s 19.5 dBm - 89 dBm, - 70 dBm 2.3 V 3.6 V 100 mA 240 mA - 40 C + 125 C QFN-56
Espressif Systems RF System on a Chip - SoC ESP32-S3 is a low-power MCU-based system on a chip (SoC) with integrated 2.4 GHz Wi-Fi and Bluetooth Low Energy (Bluetooth LE). It consists of high-performance dual-core microprocessor (Xtensa 32-bit LX7), a ULP coprocessor, a Wi-Fi baseband, a Bluet 1.661In Stock
Min.: 1
Mult.: 1

LX7 2.412 GHz to 2.484 GHz 150 Mb/s 21 dBm - 97.5 dBm 3 V 3.6 V 91 mA, 93 mA 335 mA, 340 mA 2 MB - 40 C + 105 C QFN-56
Espressif Systems RF System on a Chip - SoC ESP32-S3 is a low-power MCU-based system on a chip (SoC) with integrated 2.4 GHz Wi-Fi and Bluetooth Low Energy (Bluetooth LE). It consists of high-performance dual-core microprocessor (Xtensa 32-bit LX7), a low power coprocessor, a Wi-Fi baseband, a 1.218In Stock
2.000Expected 7/21/2026
Min.: 1
Mult.: 1

BLE 5.0, Wi-Fi RISC 2.4 GHz 150 Mbps 21 dBm - 98.4 dBm 1.8 V 3.6 V 91 mA 340 mA - 40 C + 85 C QFN-56
Espressif Systems RF System on a Chip - SoC ESP32-S3-PICO-1 is a System-in-Package (SiP) device that is based on ESP32-S3 with integrated 2.4 GHz Wi-Fi and Bluetooth Low Energy (Bluetooth LE). It integrates 8 MB SPI flash and 2 MB SPI PSRAM. 991In Stock
4.000Expected 7/21/2026
Min.: 1
Mult.: 1
: 2.000

3 V 3.6 V 8 MB - 40 C + 85 C LGA-56 Reel, Cut Tape, MouseReel
Espressif Systems RF System on a Chip - SoC ESP32-C3FH4X is an low-power and highly-integrated MCU-based solution that supports 2.4 GHz Wi-Fi and Bluetooth Low Energy (Bluetooth LE) 5.958In Stock
5.000Expected 7/27/2026
Min.: 1
Mult.: 1

RISC-V 150 Mbps 20 dBm - 105 dBm 3 V 3.6 V 87 mA 335 mA 4 MB - 40 C + 105 C QFN-32
Espressif Systems RF System on a Chip - SoC SMD IC ESP32-S3R8, dual-core MCU, Wi-Fi 2.4G & BLE 5.0 combo, 8 MB Octal SPI PSRAM die inside, QFN 56-pin, 7*7 mm 1.624In Stock
2.000Expected 9/21/2026
Min.: 1
Mult.: 1
: 2.000

BLE 5.0, Wi-Fi RISC 2.4 GHz 150 Mbps 21 dBm - 98.4 dBm 3 V 3.6 V 91 mA 340 mA - 40 C + 85 C QFN-56 Reel, Cut Tape
Espressif Systems RF System on a Chip - SoC ESP32 ECO V3 SIP module with 4 MB flash, dual-core MCU, Wi-Fi & Bluetooth combo, LGA 48-pin, 7*7 mm
4.000Expected 8/10/2026
Min.: 1
Mult.: 1
: 2.000

Bluetooth, Wi-Fi RISC 2.4 GHz 150 Mbps 19.5 dBm - 75 dBm 3 V 3.6 V 116 mA 233 mA 4 MB - 40 C + 85 C LGA-48 Reel, Cut Tape, MouseReel
Telink RF System on a Chip - SoC 32KB SRAM, 512KB Flash, Bluetooth LE 5.1 (5.3 listed), 2.4G, Telink Mesh, AoA/AoD, TQFN 7mmx7mm, 48 pins Non-Stocked
Min.: 15.000
Mult.: 15.000

Bluetooth 2.4 GHz to 2.4835 GHz 2 Mbps 10 dBm - 96 dBm 1.8 V 3.6 V 9.1 mA 9.5 mA 512 kB - 40 C + 85 C TQFN-48

Renesas Electronics RF System on a Chip - SoC SOC PLC MODEM LSI SMART GRID ASSP
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

ARM Cortex M3 - 40 C + 85 C VFQFN-64 Tray