32 bit DRAM

Results: 406
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Memory Size Data Bus Width Maximum Clock Frequency Package/Case Organisation Access Time Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Series Packaging
ISSI DRAM 128M, 3.3V, M-SDRAM 4Mx32, 133Mhz, RoHS
240Expected 10/28/2026
Min.: 1
Mult.: 1

SDRAM Mobile 128 Mbit 32 bit 133 MHz BGA-90 4 M x 32 8 ns 2.7 V 3.6 V - 40 C + 85 C IS42SM32400H Reel
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 86 pin TSOP II (400 mil) RoHS
108Expected 5/28/2026
Min.: 1
Mult.: 1

SDRAM 128 Mbit 32 bit 166 MHz TSOP-II-86 4 M x 32 5.4 ns 3 V 3.6 V - 40 C + 105 C
Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

SDRAM - LPDDR4X 24 Gbit 32 bit 2.133 GHz FBGA-200 768 M x 32 600 mV 1.8 V - 20 C + 85 C LPDDR4x Tray
Intelligent Memory DRAM SDRAM, 64Mb, 3.3V, 2Mx32, 166MHz (166Mbps), -40C to +85C, FBGA-54 Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

SDRAM 64 Mbit 32 bit 166 MHz FBGA-90 2 M x 32 5.4 ns 3 V 3.6 V - 40 C + 85 C IM6432SD Tray
Intelligent Memory DRAM LPDDR4x 8Gb 256Mx32 2133MHz FBGA200 -20C to 85C Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1

SDRAM - LPDDR4X 8 Gbit 32 bit 2.133 GHz FBGA-200 256 M x 32 600 mV 1.8 V - 20 C + 85 C LPDDR4x Tray
Intelligent Memory DRAM LPDDR4x 24Gb 768Mx32 2133MHz FBGA200 -40C to 85C Non-Stocked Lead-Time 10 Weeks
Min.: 120
Mult.: 120

SDRAM - LPDDR4X 24 Gbit 32 bit 2.133 GHz FBGA-200 768 M x 32 600 mV 1.8 V - 40 C + 95 C LPDDR4x Tray
Kingston DRAM 32Gb 200 ball LPDDR4 3733MHz -25c to 85c Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

SDRAM - LPDDR4 32 Gbit 32 bit FBGA-200 1024 M x 32 1.7 V 1.95 V - 25 C + 85 C Tray
Kingston DRAM 32Gb 200 ball LPDDR4 3733MHz Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

SDRAM - LPDDR4 32 Gbit 32 bit 1.86 GHz FBGA-200 1024 M x 32 3.5 ns 1.1 V 1.8 V - 40 C + 95 C Tray
Kingston DRAM 16Gb 200 ball LPDDR4 3733MHz Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

SDRAM - LPDDR4 16 Gbit 32 bit 1.866 GHz FBGA-200 512 M x 32 1.1 V 1.8 V - 25 C + 85 C Tray
Kingston DRAM 16Gb 200 ball LPDDR4 3733MHz Lead-Time 24 Weeks
Min.: 1
Mult.: 1
Max.: 20

SDRAM - LPDDR4 16 Gbit 32 bit 1.86 GHz FBGA-200 512 M x 32 3.5 ns 1.1 V 1.8 V - 40 C + 95 C Tray
Intelligent Memory DRAM ECC LPDDR4, 4Gb, 1.1V, 128Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SDRAM - LPDDR4 4 Gbit 32 bit 1.6 GHz FBGA-200 128 M x 32 1.06 V 1.17 V - 40 C + 95 C IME4G32L4 Tray
Intelligent Memory DRAM ECC LPDDR4, 8Gb, 1.1V, 256Mx32, 1600MHz (3200Mbps), -40C to +95C, FBGA-200 Non-Stocked Lead-Time 26 Weeks
Min.: 68
Mult.: 68

SDRAM - LPDDR4 8 Gbit 32 bit 1.6 GHz FBGA-200 256 M x 32 1.06 V 1.17 V - 40 C + 95 C IME8G32L4 Tray
Infineon Technologies S80KS2564GACHA043
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 85 C Reel
Infineon Technologies S80KS2564GACHB040
Infineon Technologies DRAM SPCM Non-Stocked Lead-Time 26 Weeks
Min.: 260
Mult.: 260

HyperRAM 256 Mbit 32 bit 200 MHz FBGA-49 35 ns 1.7 V 2 V - 40 C + 105 C Tray
ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM Mobile 512 Mbit 32 bit 133 MHz BGA-90 16 M x 32 6 ns 2.3 V 3 V 0 C + 70 C IS42RM32160E Reel
ISSI DRAM 512M, 3.3V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM Mobile 512 Mbit 32 bit 133 MHz BGA-90 16 M x 32 6 ns 2.7 V 3.6 V 0 C + 70 C IS42SM32160E Reel
ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

SDRAM Mobile 512 Mbit 32 bit 133 MHz BGA-90 16 M x 32 6 ns 2.3 V 3 V 0 C + 70 C IS42RM32160E Tray
ISSI DRAM 512M, 3.3V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

SDRAM Mobile 512 Mbit 32 bit 133 MHz BGA-90 16 M x 32 6 ns 2.7 V 3.6 V 0 C + 70 C IS42SM32160E Tray
ISSI DRAM Automotive (-40 to +105C), 128M, 3.3V, SDRAM, 4Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

SDRAM 128 Mbit 32 bit 166 MHz BGA-90 4 M x 32 6 ns 3 V 3.6 V - 40 C + 105 C IS45S32400F Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 1.06 V 1.17 V - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 1.06 V 1.17 V - 40 C + 105 C Reel
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 570 mV 650 mV - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 40 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 570 mV 650 mV - 40 C + 95 C Reel
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 40 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 570 mV 650 mV - 40 C + 105 C Tray
ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 36 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 570 mV 650 mV - 40 C + 95 C Reel