.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
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Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 300
Mult.: 300
Reel: 300
No
LPAM Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Datasheet
Non-Stocked Lead-Time 4 Weeks
Min.: 300
Mult.: 300
Reel: 300
No
LPAM Reel