1.6 GHz Semiconductors

Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS
NXP Semiconductors Microprocessors - MPU Layerscape 64-bit Arm Cortex-A53, Quad-core, 1.6GHz, -40 to 105C, Security disabled, 21x21 pkg
1In Stock
Min.: 1
Mult.: 1
NXP Semiconductors Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.6GHz, 0 to 105C, Security disabled
4In Stock
Min.: 1
Mult.: 1

NXP Semiconductors Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.6GHz, -40 to 105C, Security enabled
5In Stock
Min.: 1
Mult.: 1

Alliance Memory DRAM DDR4, 8Gb, 512M x 16, 1.2V, 96-ball FBGA, 1600Mhz, Industrial Temp Rev.A - Tray 502In Stock
Min.: 1
Mult.: 1

Alliance Memory DRAM DDR4, 8Gb, 512M x 16, 1.2V, 96-ball FBGA, 1600Mhz, Industrial Temp Rev.A - Reel 2.061In Stock
Min.: 1
Mult.: 1
: 1.500

Winbond DRAM 2Gb LPDDR4, x16, 1600MHz, -40C 105C 399In Stock
7Expected 5/21/2026
Min.: 1
Mult.: 1
Max.: 100

Winbond DRAM 4Gb LPDDR4, DDP, x32, 1600MHz, -40C 105C 288In Stock
Min.: 1
Mult.: 1
Max.: 100

Alliance Memory DRAM DDR4, 16Gb, 1G x 16, 1.2V, 96-Ball FBGA SDRAM, Commercial Temp - Tray 335In Stock
Min.: 1
Mult.: 1

Alliance Memory DRAM DDR4, 8Gb, 512M x 16, 1.2V, 96-ball FBGA, 1600Mhz, Commercial Temp Rev.A - Tray 8In Stock
Min.: 1
Mult.: 1

Winbond DRAM 2Gb LPDDR4X, x16, 1600MHz, -40C 105C 53In Stock
Min.: 1
Mult.: 1
Max.: 100

Alliance Memory DRAM LPDDR4, 2G, 128M x 16, 1.1V, 200 BALL TFBGA, 1600MHZ, ECC, AUTO TEMP - Tray 19In Stock
Min.: 1
Mult.: 1

NXP Semiconductors Processors - Application Specialised i.MX 8M Plus Dual
630Expected 6/29/2026
Min.: 1
Mult.: 1

Alliance Memory DRAM LPDDR4, 4G, 256M x 16, 1.1V, 200 BALL TFBGA, 1600MHZ, ECC, AUTO TEMP - Tray 5In Stock
Min.: 1
Mult.: 1

Intel CPU - Central Processing Units Intel Xeon Processor D-1539 (12M Cache
7Expected 10/29/2026
Min.: 1
Mult.: 1

Intel CPU - Central Processing Units Intel Atom x5-E3940 Processor
17Expected 12/16/2026
Min.: 1
Mult.: 1

ISSI DRAM 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS
809Expected 8/7/2026
Min.: 1
Mult.: 1

Alliance Memory DRAM LPDDR4, 4G, 128M x 32, 1.1V, 200 BALL TFBGA, 1600MHZ, ECC, AUTO TEMP - Tray
367Expected 5/27/2026
Min.: 1
Mult.: 1

ISSI DRAM 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
132On Order
Min.: 1
Mult.: 1

SMARTsemi DRAM DDR4, 8Gb, 512Mbx16, 1600Mhz, 3200Mbps, 1.2V, 96-ball FBGA, Commercial temp N/A
Min.: 1
Mult.: 1

SMARTsemi DRAM DDR4, 8Gb, 1Gbx8, 1600Mhz, 3200Mbps, 1.2V, 78-ball FBGA, Commercial temp Non-Stocked
Min.: 1
Mult.: 1

SMARTsemi DRAM DDR4, 8Gb, 1Gbx8, 1600Mhz, 3200Mbps, 1.2V, 78-ball FBGA, Industrial temp N/A
Min.: 1
Mult.: 1

Intel CPU - Central Processing Units Intel Celeron Proces sor G3902E (2M Cach Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

NXP Semiconductors Microprocessors - MPU Layerscape 64-bit Arm Cortex-A53, Dual-core, 1.6GHz, AEC-Q100 Grade 3, Security enabled, 23x23 pkg
Non-Stocked Lead-Time 52 Weeks
Min.: 60
Mult.: 60

NXP Semiconductors Microprocessors - MPU Layerscape 64-bit Arm Cortex-A53, Dual-core, 1.6GHz, 0 to 105C, Security enabled, 23x23 pkg
Non-Stocked Lead-Time 39 Weeks
Min.: 1
Mult.: 1

NXP Semiconductors Microprocessors - MPU Layerscape 64-bit Arm Cortex-A53, Dual-core, 1.6GHz, 0 to 105C, Security disabled, 23x23 pkg Non-Stocked Lead-Time 39 Weeks
Min.: 60
Mult.: 60