Tflex™ HD90000 Thermal Gap Filler

Laird Technologies Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Technologies Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.

No Results Found.
Try modifying your search term below or visit our Help Centre.
Search Suggestions
  • Check spelling of part number or keywords
  • Use fewer or different keywords
  • Search on 1 part number at a time
  • Apply 1 filter at a time
Products & Manufacturers
Additional Questions?