Tflex SF4 Thermal Gap Fillers

Laird Technologies Tflex SF4 Thermal Gap Fillers are silicon-free and offer a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity. These gap fillers provide products with excellent deflection properties, providing minimal pressure on components during deflection. A minimal amount of pressure is required to reach the lowest possible thermal resistance. Laird Technologies Tflex SF4 Thermal Gap Fillers are designed for datacom systems, automotive electronics, optical modules, and cameras.

No Results Found.
Try modifying your search term below or visit our Help Centre.
Search Suggestions
  • Check spelling of part number or keywords
  • Use fewer or different keywords
  • Search on 1 part number at a time
  • Apply 1 filter at a time
Products & Manufacturers
Additional Questions?