IT14-688S-BGA-2.5H

Hirose Connector
798-IT14688SBGA-2.5H
IT14-688S-BGA-2.5H

Mfr.:

Description:
Board to Board & Mezzanine Connectors BGA Mezzanine Connector, 112.0 Gbps, 0.9 mm Pitch, 688pos., 1.2 A

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In Stock: 298

Stock:
298 Can Dispatch Immediately
Quantities greater than 298 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
81,33 € 81,33 €
66,31 € 663,10 €
61,27 € 1.531,75 €
Full Reel (Order in multiples of 150)
61,27 € 9.190,50 €

Product Attribute Attribute Value Select Attribute
Hirose Electric
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Connectors
688 Position
0.9 mm (0.035 in)
11 Row
Solder
Vertical
5 mm
1.2 A
30 V
- 55 C
+ 105 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
IT14
Reel
Cut Tape
Brand: Hirose Connector
Data Rate: 112 Gb/s
Flammability Rating: UL 94 V-0
Insulation Resistance: 1 GOhms
Mounting Style: PCB Mount
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 150
Part # Aliases: 636-6001-0-00
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TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

IT14 Low-Profile BGA Mezzanine Connectors

Hirose Electric IT14 Low-Profile BGA Mezzanine Connectors support high-speed differential signals up to 56Gbps NRZ/112Gbps PAM4. The hermaphroditic IT14 series features a self-mating design that eliminates the need for additional mating parts, reducing overall costs and increasing reliability. The IT14 connector utilizes a high-density design and features a stubless two-point contact design for ultra-reliability and protective housing to encapsulate the contact tips to prevent warping. The series has a wide operating temperature range of -55°C to +105°C. Hirose Electric IT14 Low-Profile BGA Mezzanine Connectors are suitable for data centers, servers, and telecommunication equipment use.

Router & Server Solutions

Hirose Router and Server Solutions feature high-density interconnect products engineered for modular server systems, routers, and data infrastructure. These solutions include ultra-high-speed mezzanine and board-to-board connectors, enabling transmission up to 112Gbps with advanced signal integrity features like FEXT and EMI mitigation. For robust power delivery, Hirose wire-to-board and floating power connectors support up to 70A and hot-swappable designs. Hirose router and server products are built for modular architectures and harsh environments, simplifying I/O integration across Ethernet systems, data centers, edge computing, switches, backplane interfaces, and rack-mounted or blade servers.