908-35-2-12-2-B-0

Name: Wakefield Thermal 908-35-2-12-2-B-0
Brand: Wakefield Thermal
SKU: 567-908-35-2-12-2-B
Price: 10.24 EUR
Availability: InStock

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Mouser No:

567-908-35-2-12-2-B

Mfr. No:

908-35-2-12-2-B-0

Mfr.:

Wakefield Thermal

Description:

Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 35mm Chip Size, 11.6mm Height, Aluminum

Datasheet:

908-35-2-12-2-B-0 Datasheet (PDF)

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In Stock: 47

Stock:: 47 Can Dispatch Immediately

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Factory Lead Time:: 16 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	10,24 €	10,24 €
	9,85 €	98,50 €
	9,31 €	232,75 €
	8,75 €	437,50 €
	8,21 €	821,00 €
	7,67 €	2.301,00 €
	7,36 €	4.416,00 €
	7,09 €	8.508,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	Component, 35mm
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Elliptical Pin
Length:	35 mm
Width:	35 mm
Height:	11.6 mm
Brand:	Wakefield Thermal
Color:	Black
Product Type:	Heat Sinks
Series:	900
Factory Pack Quantity:	300
Subcategory:	Heat Sinks
Type:	Component
Unit Weight:	16,330 g

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Datasheet

908-35-2-12-2-B-0 Datasheet (PDF)

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RoHS Certificate (PDF)

TARIC:: 8542900000
CNHTS:: 8548000090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
MXHTS:: 8542900100
ECCN:: EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.