HDTM-3-06-2-S-VT-0-3

Samtec
200-HDTM-3062SVT03
HDTM-3-06-2-S-VT-0-3

Mfr.:

Description:
High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:
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Learn more about Samtec HDTM-3-06-2-S-VT-0-3

Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
9,45 € 9,45 €
8,20 € 205,00 €
6,93 € 346,50 €
5,13 € 2.765,07 €

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: High Speed/Modular Connectors
RoHS:  
Headers
6 Row
1.8 mm
Solder Pin
Gold
HDTM
Tray
Brand: Samtec
Contact Material: Copper Alloy
Housing Colour: Black
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 77
Subcategory: Backplane Connectors
Tradename: XCede
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Attributes selected: 0

Datasheet

Technical Resources

Compliance Codes
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.

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