HDTM-3-06-1-S-VT-2-1

Samtec
200-HDTM3061SVT21
HDTM-3-06-1-S-VT-2-1

Mfr.:

Description:
Headers & Wire Housings

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
3 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
9,93 € 9,93 €
8,62 € 215,50 €
7,28 € 393,12 €
5,30 € 572,40 €
4,90 € 2.646,00 €

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Headers & Wire Housings
Brand: Samtec
Product Type: Headers & Wire Housings
Factory Pack Quantity: 54
Subcategory: Headers & Wire Housings
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Attributes selected: 0

Origin Classifications
Country of Origin:
Not available
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.