It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

EBTM-6-08-2.0-S-RA-1-R-G

Name: Samtec EBTM-6-08-2.0-S-RA-1-R-G
Brand: Samtec
SKU: 200-EBTM60820SRA1RG
Price: 32.21 EUR
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser No:

200-EBTM60820SRA1RG

Mfr. No:

EBTM-6-08-2.0-S-RA-1-R-G

Mfr.:

Samtec

Description:

High Speed/Modular Connectors ExaMAX 2.00 mm High-Speed Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

EBTM-6-08-2.0-S-RA-1-R-G Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Series:	EBTM
Packaging:	Tray
Brand:	Samtec
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	25
Subcategory:	Backplane Connectors

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

EBTM-6-08-2.0-S-RA-1-R-G Datasheet (PDF)

Conflict Material Declaration (Spreadsheet)

Compliance Codes

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: Vietnam
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

ExaMAX® High-Speed Backplane System

Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.