PCA9601DPZ

Images are for reference only
See Product Specifications

Mouser No:

771-PCA9601DPZ

Mfr. No:

PCA9601DPZ

Mfr.:

NXP Semiconductors

Description:

Interface - Signal Buffers, Repeaters I2C-bus buffer

Lifecycle:

Obsolete

Datasheet:

PCA9601DPZ Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Shipping Alert:

Mouser does not presently sell this product in your region.

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	NXP
Product Category:	Interface - Signal Buffers, Repeaters
Delivery Restrictions:	Mouser does not presently sell this product in your region.
RoHS:
Product:	Buffers
Interface Type:	I2C
Propagation Delay Time:	100 ns
Supply Voltage - Max:	15 V
Supply Voltage - Min:	2.5 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Mounting Style:	SMD/SMT
Package/Case:	TSSOP-8
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	NXP Semiconductors
Operating Supply Current:	5 mA
Operating Supply Voltage:	2.5 V to 15 V
Output Current:	2 mA
Output Type:	Open Collector
Pd - Power Dissipation:	300 mW
Product Type:	Signal Buffers, Repeaters
Series:	PCA9601
Factory Pack Quantity:	2500
Subcategory:	Interface ICs
Part # Aliases:	935290859431

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

PCA9601DPZ Datasheet (PDF)

PCN

This functionality requires JavaScript to be enabled.

Compliance Codes

CNHTS:: 8542399000
USHTS:: 8542390090
ECCN:: EAR99

Origin Classifications

Country of Origin:: Thailand
Assembly Country of Origin:: Thailand
Country of Diffusion:: China

The country is subject to change at the time of shipment.

Logic

NXP Semiconductors Logic portfolio consists of the industry’s smallest, leadless DQFN package for gates, octals, and MSI functions simplifying PCB routing, and the world’s smallest MicroPak™ and Diamond™ packages for single-, dual-, and triple-gate logic. We NXP continually invests in new process and package technologies, as well as new packaging facilities, focus on increasing performance, lowering power consumption, and reducing size and have the largest portfolio of dedicated Q100 devices.