215760-1007

Name: Molex 215760-1007
Brand: Molex
SKU: 538-215760-1007
Price: 1.95 EUR
Availability: InStock

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Mouser No:

538-215760-1007

Mfr. No:

215760-1007

Mfr.:

Molex

Description:

Headers & Wire Housings Micro-Fit+ RA Header 7Circuits Black

Datasheet:

215760-1007 Datasheet

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	PCB Receptacle
Number of Positions:	7 Position
Pitch:	3 mm (0.118 in)
Number of Rows:	1 Row
Mounting Style:	PCB Mount
Termination Style:	Solder Pin
Mounting Angle:	Right Angle
Contact Plating:	Tin
Series:	215760
Tradename:	Micro-Fit+
Application:	Wire-to-Board, Power
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tray
Brand:	Molex
Contact Material:	Copper Alloy
Current Rating:	13 A
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Gender:	Receptacle
Housing Material:	Liquid Crystal Polymer (LCP)
Insulation Resistance:	1 GOhms
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	98
Subcategory:	Headers & Wire Housings
Voltage Rating:	600 VAC/600 VDC
Part # Aliases:	2157601007 02157601007

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Technical Resources

Compliance Codes

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.