C1206F334K3RACTU

KEMET
80-C1206F334K3RACTU
C1206F334K3RACTU

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 25V 0.33uF X7R 1206 10%
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Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
31 Weeks Estimated factory production time.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,705 € 0,71 €
0,471 € 4,71 €
0,322 € 32,20 €
0,263 € 131,50 €
0,243 € 243,00 €
Full Reel (Order in multiples of 2000)
0,20 € 400,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
KEMET
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
0.33 uF
25 VDC
X7R
10 %
1206
3216
SMD/SMT
Standard
- 55 C
+ 125 C
3.3 mm (0.13 in)
1.6 mm (0.063 in)
Open Mode/Fail-Safe MLCCs
SMD Comm X7R FO
Reel
Cut Tape
MouseReel
Brand: KEMET
Class: Class 2
Package/Case: 1206 (3216 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 2000
Subcategory: Capacitors
Tradename: FO-CAP
Type: Commercial Grade MLCC
Part # Aliases: C1206F334K3RAC7800
Unit Weight: 27 mg
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Attributes selected: 0

Datasheet

KSIM

Models

Specification Sheets

Compliance Codes
TARIC:
8532240000
CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
BRHTS:
85322410
ECCN:
EAR99
Origin Classifications
Country of Origin:
Mexico
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

X7R Auto & Commercial Open Mode Capacitors

KEMET X7R Auto and Commercial Open Mode Capacitors offer a 16VDC to 200VDC voltage range, 1000pF to 6.8µF capacitance, and ±5%, ±10%, or ±20% capacitance tolerance. These capacitors feature flexible termination technology that inhibits the transfer of board stress to the rigid ceramic body. This technology provides superior flex performance over standard termination systems, offering superior protection against a low IR or short-circuit condition. KEMET X7R Auto and Commercial Open Mode Capacitors operate in a -55°C to +125°C operating temperature range.

Open Mode FO-CAP MLCCs

KEMET Open Mode Design (FO-CAP) MLCCs in X7R dielectric were designed to significantly minimize the potential of low IR or short circuit when the capacitor is forced to failure in a board stress flex situation. The Open Mode capacitor may experience capacitance loss with no chance of a short because a flex crack will not typically propagate across counter electrodes within the device's "active area." The lack of current leakage from the Open Mode flex crack eliminates localized heating, therefore, greatly reducing the risk of a catastrophic and costly failure event. Open Mode designed devices compliment KEMET Floating Electrode (FE-CAP) and Floating Electrode with Flexible Termination (FF-CAP) products by providing a fail-safe design optimized for mid to high-range capacitance values.

Flexible Mitigation Surface Mount ≤250V MLCCs

KEMET Flexible Mitigation Surface Mount ≤250V MLCCs are solutions designed to reduce the risk of flex cracks. These solutions include the following: Flexible Termination (FT-CAP), Floating Electrode (FE-CAP), and Open Mode (FO-CAP) Technology. 

High CV Multilayer Ceramic Capacitors (MLCCs)

KEMET High CV Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability, and cost advantages for circuit designers. Ceramics are non-polar devices that offer unsurpassed volumetric efficiency, delivering high capacitance in small package sizes. Available in a wide range of sizes, KEMET High CV MLCCs offer very low equivalent series resistance (ESR), exhibit excellent high-frequency characteristics, and are very reliable. MLCCs are monolithic devices that consist of laminated layers of specially formulated ceramic dielectric materials interspersed with a metal electrode system. The layered formation is then fired at a high temperature to produce a sintered and volumetrically efficient capacitance device. A conductive termination barrier system is integrated into the exposed ends of the chip to complete the connection. 

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