It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

CL8068403359116S R3YX

Name: Intel CL8068403359116S R3YX
Brand: Intel
SKU: 607-68403359116SR3YX
Price: 611.18 EUR
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser No:

607-68403359116SR3YX

Mfr. No:

CL8068403359116S R3YX

Mfr.:

Intel

Description:

CPU - Central Processing Units Intel Xeon E-2176M Processor (12M Cache, up to 4.40 GHz) FC-BGA14F, Tray

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Intel CL8068403359116S R3YX

Availability

Stock:: 0

You can still purchase this product for backorder.

An unexpected error occurred. Please try again later.
Factory Lead Time:: 30 Weeks Estimated factory production time.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	611,18 €	611,18 €
	536,79 €	5.367,90 €

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Intel
Product Category:	CPU - Central Processing Units
RoHS:
Product:	Mobile Processors
Core:	Intel Xeon
Data Bus Width:	64 bit
Number of Cores:	6 Core
Package/Case:	FCBGA-1440
Maximum Clock Frequency:	2.7 GHz
Cache Memory:	12 MB
Number of Threads:	12 Thread
TDP - Max:	45 W
Memory Size:	64 GB
Memory Type:	DDR4-2666, LPDDR3-2133
System Bus Speed:	8 GT/s
System Bus Type:	DMI
Family:	Intel Xeon
Code Name:	Coffee Lake
Processor Series:	E-2176M
Embedded Options:	Embedded
Maximum Operating Temperature:	+ 100 C
Packaging:	Tray
Brand:	Intel
CPU Configuration - Max:	1 Configuration
ECC Memory Supported:	Supported
Intel Hyper-Threading Technology:	With HT Technology
Intel Virtualisation Technology - VT:	With VT
Lithography - Process Technology:	14 nm
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Number of Displays Supported:	3 Display
Number of Memory Channels:	2 Channel
Number of PCI Express Lanes:	16 Lane
PCIe Configurations:	1x16, 2x8, 1x8 + 2x4
PCIe Revision:	Revision 3.0
Product Type:	CPU - Central Processing Units
Series:	E-2176M
Factory Pack Quantity:	1
Subcategory:	Embedded Processors & Controllers
Tradename:	Xeon
Turbo Frequency - Max:	4.4 GHz
Part # Aliases:	963717
Unit Weight:	123,145 g

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

This functionality requires JavaScript to be enabled.

Compliance Codes

TARIC:: 8542319000
USHTS:: 8542310045
ECCN:: 5A992.C

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

4th Generation Xeon® Processors

Intel 4th Generation Xeon® Processors are manufactured on the industry-leading 22nm process technology with 3D Tri-Gate transistors, delivering quad-core processing and intelligent performance capabilities, including Intel Turbo Boost Technology 2.0 and Hyper-Threading Technology. Additionally, it boosts performance to integer/matrix calculations through Intel Advanced Vector Extensions 2.0 enhancements.

Xeon E Processors (2100 Series)

Intel® Xeon® E Processors (2100 Series) deliver enhanced performance, reliability, and security for professional CAD, media, and mobile workstations. Xeon E Processors improve processor speed, memory capabilities, hardware, security, and reliability. The processors support 4K UHD Intel® graphics technology. The Xeon E is ideal for frequency-bound workstation applications with up to 6 cores and frequencies up to 4.7GHz.

4th Generation Processors

Intel 4th generation Core Processor family delivers Desktop, Mobile, and Embedded products with maximum performance per watt. Intel Haswell Architecture is based on a 22nm process and utilizes FinFET technology for reduced leakage and lowered power consumption. Idle state power consumption has been lowered, creating a 20x improvement from the previous generation, with a 3 second wakeup time possible using Intel Rapid Start.