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140-507-210-011

Name: EDAC 140-507-210-011
Brand: EDAC
SKU: 587-140-507-210-011
Price: 0.08 EUR
Availability: InStock

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Mouser No:

587-140-507-210-011

Mfr. No:

140-507-210-011

Mfr.:

EDAC

Description:

Headers & Wire Housings 140 Series Wire to Board in-line 2.0mm pitch connector with 7 slots for crimp and load female (socket) contacts

Datasheet:

140-507-210-011 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about EDAC 140-507-210-011

In Stock: 1.196

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	0,086 €	0,09 €
	0,068 €	0,68 €
	0,056 €	1,40 €
	0,05 €	5,00 €
	0,043 €	10,75 €
	0,036 €	36,00 €
	0,031 €	77,50 €
	0,03 €	300,00 €
	0,028 €	560,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	EDAC
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Shrouded
Number of Positions:	7 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Mounting Angle:	Straight
Contact Plating:	Tin
Series:	140
Application:	Wire-to-Board
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Brand:	EDAC
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Colour:	Natural
Housing Gender:	Female
Housing Material:	Polyamide (PA)
Insulation Resistance:	1 GOhms
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1
Subcategory:	Headers & Wire Housings
Voltage Rating:	100 V

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USHTS:: 8538906000
ECCN:: EAR99

140 Series 2mm Wire-to-Board Connectors

EDAC 140 Series 2mm Wire-to-Board Connectors are available in various positions with top-entry or side-entry configurations. Additional variations include right-angle, vertical, and SMT or through-hole mounted to the PCB. These inline connectors are designed for the high-density connection of internal wires to PCBs with a thickness of 1.2mm to 1.6mm. They have a 2A current rating and a low-profile insulator body with a 6.1mm height and 4.70mm width. They operate in a -40°C to +105°C temperature range. EDAC 140 Series 2mm Wire-to-Board Connectors are compatible with leading industry connectors as drop-in replacements and ideal for use in wire harness applications.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.